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Ningbo Yuyao semiconductor sputtering targets

Target suitability is not decided by a purity number alone. Inclusions, grain size, texture, target-to-backing bonding, surface cleanliness and chamber fit jointly affect sputtering stability and film defects.

Formation and regional foundations

The Yuyao cluster extends from high-purity metal preparation to precision machining and customer qualification near Yangtze Delta semiconductor customers. Qualification belongs to a specific material, size and application platform, not every advanced node.

The inquiry enters eight specific operations from initial feedstock confirmation, tracing quality change, lot evidence and delivery boundary for Ningbo Yuyao semiconductor sputtering targets.

Core geography: The scope is high-purity metal sputtering-target manufacturing for semiconductor film deposition in Yuyao and relevant Ningbo bases, covering purification, melting, working, machining, bonding and clean packing. Construction sheet, display-panel assembly and group capacity elsewhere are excluded.

From feedstock to lot delivery

Six production and validation nodes

Feed purity, melt, heat-treatment lot, machined dimensions and bonding record resolve to each target.

  • high-purity feed confirmation — metal feedstock is checked here against purity, trace elements and lot.
  • vacuum melting — high-purity metal charge is checked here against vacuum, temperature and charge order.
  • thermomechanical working — ingot and billet is checked here against strain, temperature and direction.
  • microstructure heat treatment — worked target blank is checked here against ramp, soak and loading.
  • precision machining — heat-treated blank is checked here against dimensions, flatness and surface.
  • backing-plate bonding — target and backing plate is checked here against interface cleanliness, bond and voids.

01 · High-purity feed confirmation

High-purity feed confirmation first fixes the lot origin and input conditions.

Before metal feedstock enters high-purity feed confirmation, purity, trace elements and lot must align to one lot, specification and date.

The easily missed issue is cross-contamination or inclusion, which may surface only at a later operation.

That is why analysis certificate and retained sample is retained instead of copying only the final pass decision.

02 · Vacuum melting and casting

Vacuum melting and casting changes the material state received by the next operation.

vacuum melting is not isolated; a change in vacuum, temperature and charge order travels with the product.

When gas inclusion or segregation appears, equipment, material and shift are compared before the inquiry expands.

heat curve and sample result supplies a reproducible process rather than a judgement from habit.

03 · Thermomechanical working

Thermomechanical working keeps process settings with the lot number.

At thermomechanical working, the state of ingot and billet already carries upstream effects, so sampling location cannot drift.

When strain, temperature or rolling direction leaves its window, identify affected slabs separately from later target blanks and use structure and dimensional records to define the impact.

The inquiry uses working history and ultrasonic record to separate random variation from systematic shift and records nonuniform structure or crack as a deviation.

04 · Microstructure heat treatment

Microstructure heat treatment is interpreted with equipment state and operating time.

microstructure heat treatment turns material properties into a deliverable feature, so ramp, soak and loading is not improvised by an operator.

grain growth or texture shift often affects quality and yield together, so output alone hides the cost.

furnace uniformity and micrographs returns to equipment ID, operator and time, while the abnormal sample retains its as-found state.

05 · Precision machining

Changes created during Precision machining remain visible to downstream tests.

At precision machining, heat-treated blank is tied to customer use; a generic name does not establish fit.

dimensions, flatness and surface jointly determine performance, and replacing any item requires evaluation of burr, scratch or residual stress.

Before release, dimension report and tool history is checked item by item against the order revision so a good product does not reach the wrong application.

06 · Backing-plate bonding

Backing-plate bonding becomes comparable only with a stated method and limit.

backing-plate bonding must answer what was measured, where and by which method; one number is insufficient.

When debonding or thermal resistance anomaly occurs, the history of interface cleanliness, bond and voids explains more than a single retest.

scan result and bonding parameters stays with the sample ID, and results from different method revisions are not pooled directly.

07 · Cleaning and clean packing

Cleaning and clean packing hands the manufacturing result to packing, transport or integration.

At cleaning and clean packing, finished target may be ready for delivery but transport and use limits still need validation.

Packaging, temperature, vibration or waiting time may cause recontamination or oxidation; factory acceptance cannot protect a target face or backing bond unless clean packing and handling remain controlled.

cleaning lot and particle record anchors responsibility to lot and handover, making an arrival failure reviewable.

08 · Customer-platform delivery

Customer-platform delivery closes the handover with destination, revision and responsible entity.

customer-platform delivery turns one run into a traceable conclusion, and spec, chamber fit and qualification revision is complete before sign-off.

Even with passing results, wrong platform or film defect may still require quarantine, investigation or customer communication.

Finally, serial and customer acceptance checks material balance, changes and destination; disposition must use this target’s melt, microstructure, dimensions and bond record.

Sources and reading notes

The cluster list establishes place and industry identity. Local projects, company disclosures and product records separately check construction, material form and supply status; purity, capacity and sales are not merged.

  • Formal sources check the industry identity.
  • Target blanks, finished targets and backing-plate bonding projects are labelled by their own stage.
  • A firm must evidence both a Yuyao production site and a sputtering-target product.
  • Group sales, base investment and one production line’s capacity are not interchangeable.

Related companies

These companies have a locally relevant industry role supported by public information. Order is not a ranking, inclusion does not imply authorization, partnership or endorsement, and Hello China does not participate in or guarantee transactions.

A company may request a free correction or removal through the formal channel if its record is inaccurate or it does not wish to be shown. Do not send business licences, authorization letters or other sensitive files through insecure channels.

  • Ningbo Chuangrun New Materials Co Ltd — Ningbo Chuangrun New Materials Co Ltd undertakes high-purity metals and target blanks locally; the Ningbo Chuangrun New Materials Co Ltd brief uses only publicly verifiable entity, site, product and licence information.
  • Ningbo Jiangfeng Electronic Materials Co Ltd — Ningbo Jiangfeng Electronic Materials Co Ltd undertakes high-purity semiconductor sputtering targets locally; the Ningbo Jiangfeng Electronic Materials Co Ltd brief uses only publicly verifiable entity, site, product and licence information.
  • Ningbo Runping Electronic Materials Co Ltd — Ningbo Runping Electronic Materials Co Ltd undertakes electronic materials and target processing locally; the Ningbo Runping Electronic Materials Co Ltd brief uses only publicly verifiable entity, site, product and licence information.
  • Request a company-record correction or removal — Requests are reviewed by a person, handled promptly after verification, free of charge and not tied to commercial cooperation.

Sources

Use the original publishers to check dates, scope and definitions; public material is not a transaction guarantee.