Zhuzhou Shifeng power semiconductors · Manufacturer

Zhuzhou YueMo Advanced Semiconductor Co., Ltd.

YueMo enters the Zhuzhou chain through wafer-level and system-in-package work. Packaging is not a chip shell but a combination of redistribution, interconnect, heat spreading and mechanical protection that must address warpage, interfaces and test access during design.

Published company identity

Shifeng District · Private enterprise

Published products and capabilities

Wafer-level and system-in-package devices

Regional influence evidence

A Hunan industry profile identifies YueMo wafer-level and system-in-package lines together with design, development and processing capabilities for local power-device projects.
Advanced packaging links local chips with systems and exposes thermal expansion, parasitics and multi-die coordination that bare-die data cannot answer.

Checkable sources

Shifeng full power-semiconductor chain — Hunan Provincial Government
Power-electronic materials, devices and applications in Shifeng — Hunan Department of Industry and Information Technology
Current Zhuzhou power-semiconductor chain — Hunan Department of Industry and Information Technology

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