Xiamen Haicang IC Packaging and Testing Cluster · Related company profile
Xiamen Tongfu Microelectronics Co., Ltd.
Xiamen Tongfu Microelectronics Co., Ltd. · Xiamen Haicang IC Packaging and Testing Cluster · Source: Xiamen Haicang Investment Group's 2021 public bond offering prospectus for professional investors, first tranche: Xiamen Tongfu advanced packaging and testing base entry
Company information
Xiamen Tongfu Microelectronics Co., Ltd.
Xiamen Haicang IC Packaging and Testing Cluster
About this information
- Xiamen Tongfu Microelectronics Co., Ltd. · Xiamen Haicang IC Packaging and Testing Cluster · Source: Xiamen Haicang Investment Group's 2021 public bond offering prospectus for professional investors, first tranche: Xiamen Tongfu advanced packaging and testing base entry
Checkable sources
Information and transaction boundary
This page uses public information to explain the company’s connection with the local industry. Inclusion does not imply authorization, partnership or endorsement, and Hello China does not participate in or guarantee transactions.
If a company believes its record is inaccurate or does not wish to be shown, it may request a correction or removal through the platform’s formal channel. Verified requests are handled promptly and free of charge. Do not send business licences, authorization letters or other sensitive files through insecure channels.
- Request confirmation, correction or removal — The link carries the company name to prepare a confirmation, correction or removal request.